Computer server

ABSTRACT

The present application describes a computer server. The computer server includes a plurality of layers of fixed plates each having at least one corresponding component provided thereon. An air inlet and an air outlet are provided on side panels of an outer shell of the server case. A first set of fans is provided on an inward-facing side of the air inlet, and a second set of fans is provided on an inward-facing side of the air outlet. The first set of fans and the second set of fans generate a high-pressure airflow from the air inlet to the air outlet. The computer server further comprises at least one first heat sink and a second heat sink, wherein the at least one first heat sink is connected to a heat generating component on the plurality of layers of fixed plates.

CROSS-REFERENCES TO RELATED APPLICATIONS

This patent application is a continuation of U.S. patent applicationSer. No. 16/242,881, titled “Computer Server,” filed on Jan. 8, 2019,published as U.S. Pre-Grant Publication 2019-0254196, which in turnclaims priority of and the benefits of Chinese Patent Application No.201711088369.2 filed with the State Intellectual Property Office ofChina (SIPO) on Nov. 8, 2017. The entire disclosures of the aboveapplications are hereby incorporated by reference in their entirety aspart of this document.

TECHNICAL FIELD

The present disclosure relates to automated driving technology, and moreparticularly, to a computer server.

BACKGROUND

Currently, in order to achieve automated driving of a vehicle, typicallyone or even more vehicle-mounted computer servers for decision makingand controlling will be provided on such vehicle. As complicatedtechniques are involved in automated driving, it is desired that thevehicle-mounted computer servers could have more powerful functions,with not only high computing capabilities and high processingefficiencies, but also capabilities of running stably for a long time(e.g., high anti-vibration capability and excellent cooling effect).Hence, compared with ordinary computer servers, a vehicle-mountedcomputer server may have a larger number of devices to be installedtherein, e.g., a number of sets of core components, such as one or morepower sources, a number of motherboards (having a number of CentralProcessing Units (CPUs) provided thereon), a number of graphics cards(each having a Graphics Processing Unit (GPU) provided thereon), anumber of Universal Serial Bus (USB) expansion cards, one or more heatsinks, and the like.

Due to a limited space in a vehicle, a vehicle-mounted computer servercannot be designed to be too high or too wide. How to assemble a largenumber of core devices compactly, densely and orderly in a case having alimited space while ensuring that they can function stably has become aproblem to be solved by those skilled in the art.

SUMMARY

A computer server is provided. The computer server includes, in aninternal space of a case, a plurality of layers of fixed plates arrangedin a vertical direction from a bottom of the case to a top of the case.Each of the plurality of layers of fixed plates has at least onecorresponding component provided thereon. An air inlet is provided on afirst side panel of an outer shell of the case, and an air outlet isprovided on a second side panel of the outer shell of the case, thefirst side panel and the second side panel being opposite to each other.A first set of fans is provided on an inward-facing side of the airinlet, and a second set of fans is provided on an inward-facing side ofthe air outlet. The first set of fans and the second set of fansgenerate a high-pressure airflow from the air inlet to the air outlet.The component on each of the plurality of layers of fixed plates iscooled by the high-pressure airflow.

BRIEF DESCRIPTION OF THE DRAWINGS

The figures are provided for facilitating further understanding of thepresent disclosure. The figures constitute a portion of the descriptionand can be used in combination with the embodiments of the presentdisclosure to interpret, rather than limiting, the present disclosure.In the figures:

FIG. 1 is a schematic diagram showing a structure of a computer serveraccording to Embodiment 1 of the present disclosure;

FIG. 2 is a schematic diagram showing a structure of a first layer offixed plate according to Embodiment 1 of the present disclosure;

FIG. 3 is a schematic diagram showing a structure of a second layer offixed plate according to Embodiment 1 of the present disclosure;

FIG. 4 is a schematic diagram showing a structure of a third layer offixed plate according to Embodiment 1 of the present disclosure;

FIG. 5 is a schematic diagram showing a structure of a fourth layer offixed plate according to Embodiment 1 of the present disclosure;

FIG. 6 is a schematic diagram showing a structure of a first set of fansaccording to Embodiment 1 of the present disclosure;

FIG. 7 is a schematic diagram showing a structure of a second set offans according to Embodiment 1 of the present disclosure;

FIG. 8A is a schematic diagram showing a structure of a set of heatpipes in a first heat sink according to Embodiment 1 of the presentdisclosure;

FIG. 8B is a schematic diagram showing a structure of a first mountingdevice according to Embodiment 1 of the present disclosure;

FIG. 8C is a schematic diagram showing each GPU on a second layer offixed plate corresponding to a set of heat pipes according to Embodiment1 of the present disclosure;

FIG. 8D is a schematic diagram showing each GPU on a third layer offixed plate corresponding to a set of heat pipes according to Embodiment1 of the present disclosure;

FIG. 8E is a schematic diagram showing each of four CPUs in fourgraphics cards on a second layer of fixed plate and a third layer offixed plate corresponding to a set of heat pipes according to Embodiment1 of the present disclosure;

FIG. 9A is a schematic diagram showing a structure of a turbofan heatsink in a first heat sink according to Embodiment 1 of the presentdisclosure;

FIG. 9B is a schematic diagram showing each CPU on a first layer offixed plate corresponding to a turbofan heat sink according toEmbodiment 1 of the present disclosure;

FIG. 10 is a schematic diagram showing a structure in which a firstlayer of fixed plate, a second layer of fixed plate, a third layer offixed plate and two sets of fans are assembled together according toEmbodiment 1 of the present disclosure;

FIG. 11 is a schematic diagram showing a structure in which four layersof fixed plates are assembled together according to Embodiment 1 of thepresent disclosure;

FIG. 12 is a schematic diagram showing a layer of cooling fins providedon a surface of a graphics card according to Embodiment 1 of the presentdisclosure;

FIG. 13 is a schematic diagram showing a structure of a computer serveraccording to Embodiment 2 of the present disclosure;

FIG. 14 is a schematic diagram showing a structure of a first layer offixed plate according to Embodiment 2 of the present disclosure;

FIG. 15 is a schematic diagram showing a structure of a second layer offixed plate according to Embodiment 2 of the present disclosure;

FIG. 16 is a schematic diagram showing a structure of a third layer offixed plate according to Embodiment 2 of the present disclosure;

FIG. 17 is a schematic diagram showing a structure of a fourth layer offixed plate according to Embodiment 2 of the present disclosure;

FIG. 18 is a schematic diagram showing a structure of a fifth layer offixed plate according to Embodiment 2 of the present disclosure;

FIG. 19 is a schematic diagram showing a structure of a sixth layer offixed plate according to Embodiment 2 of the present disclosure;

FIG. 20 is a schematic diagram showing a structure in which the firsttwo layers of fixed plates are assembled together according toEmbodiment 2 of the present disclosure;

FIG. 21 is a schematic diagram showing a structure in which the firstthree layers of fixed plates are assembled together according toEmbodiment 2 of the present disclosure;

FIG. 22 is a schematic diagram showing a structure in which the firstfour layers of fixed plates are assembled together according toEmbodiment 2 of the present disclosure;

FIG. 23 is a schematic diagram showing a structure in which the firstfive layers of fixed plates are assembled together according toEmbodiment 2 of the present disclosure;

FIG. 24 is a schematic diagram showing a structure in which the firstsix layers of fixed plates are assembled together according toEmbodiment 2 of the present disclosure; and

FIG. 25 is a schematic diagram showing a structure in which the firstsix layers of fixed plates, an outer shell of a case and sets of fansare assembled together according to Embodiment 2 of the presentdisclosure.

DETAILED DESCRIPTION OF THE EMBODIMENTS

In the following, the solutions according to the embodiments of thepresent disclosure will be described clearly and completely withreference to the figures, such that the solutions can be betterunderstood by those skilled in the art. Obviously, the embodimentsdescribed below are only some, rather than all, of the embodiments ofthe present disclosure. All other embodiments that can be obtained bythose skilled in the art based on the embodiments described in thepresent disclosure without any inventive efforts are to be encompassedby the scope of the present disclosure.

With the computer server according to the embodiment of the presentdisclosure, in the internal space of the case, a plurality of layers offixed plates are arranged in a vertical direction and each of theplurality of layers of fixed plates has at least one component providedthereon. An air inlet and an air outlet are provided on two oppositepanels of the outer shell of the case, such that a high-pressure airflowfrom the air inlet to the air outlet can be generated for cooling thecomponents on the respective layers of fixed plates. With the solutionaccording to the present disclosure, on one hand, the vertical space inthe case may be designed reasonably to avoid arranging all thecomponents on one single layer, which would otherwise result in ahorizontal dimension that is too long. The respective layers ofcomponents are separated from each other by the fixed plates, such thatthe layers of components may be arranged orderly without confusion. Onthe other hand, two sets of fans are provided on the two opposite sidepanels of the case, capable of generating a high-pressure airflow fromthe air inlet to the air outlet. The high-pressure airflow may passthrough the components on the respective layers of fixed plates arrangedin the vertical direction. That is, the components on the respectivelayers of fixed plates may be cooled by the high-pressure airflow,thereby ensuring that the heat generating components may functionstably.

The computer server according to the embodiment of the presentdisclosure may be applied to a vehicle side in an unmanned vehicle, arobot, or any other scenarios in which a volume of space of the computerserver is required. The present disclosure is not limited to anyspecific application scenario.

The computer server according to the embodiment of the presentdisclosure includes, in an internal space of a case, a plurality oflayers of fixed plates arranged in a vertical direction from a bottom ofthe case to a top of the case. Each of the plurality of layers of fixedplates has at least one corresponding component provided thereon. An airinlet is provided on a first side panel of an outer shell of the case,and an air outlet is provided a second side panel of the outer shell ofthe case, the first side panel and the second side panel being oppositeto each other. A first set of fans is provided on an inward-facing sideof the air inlet, and a second set of fans is provided on aninward-facing side of the air outlet. The first set of fans and thesecond set of fans generate a high-pressure airflow from the air inletto the air outlet. The component on each of the plurality of layers offixed plates is cooled by the high-pressure airflow.

In some embodiments of the present disclosure, the number of layers offixed plates provided in the case may be configured flexibly dependingon actual situations and the present disclosure is not limited to anyspecific number. For example, four, five or six layers of fixed platesmay be provided. In the following, the structure of the computer serveraccording to the embodiments of the present disclosure will be describedin detail with reference to examples where four and six layers of fixedplates are provided.

Embodiment 1

According to Embodiment 1 of the present disclosure, a computer serverincluding four layers of fixed plates is provided. As shown in FIG. 1, aplurality of fixed plates, such as plates 11, 12, 13 and 14, is providedinside a computer server case and the fixed plates 11-14 are structuredto include heat-generating server components or modules such as one ormore central processing units (CPUs), one or more graphics processingunits (CPUs), data storage related circuitry or other circuitry. In aninternal space of the server case, a first layer of fixed plate 11, asecond layer of fixed plate 12, a third layer of fixed plate 13 and afourth layer of fixed plate 14 are arranged in a vertical direction 230from a bottom of the case to a top of the case. The first layer of fixedplate 11 has a motherboard, a hard drive and a power source ascomponents provided thereon. The second layer of fixed plate 12 has atleast one graphics card as a component provided thereon. The third layerof fixed plate 13 has at least one graphics card as a component providedthereon. The fourth layer of fixed plate 14 has at least one expansioncard as a component provided thereon. An air inlet 240 is provided on afirst side panel of an outer shell of the case, and an air outlet 250 isprovided a second side panel of the outer shell of the case, the firstside panel and the second side panel being opposite to each other. Thesizes of the air inlet 240 and air outlet 250 can be generallyrepresented by the height or size 261 of the air inlet in the verticaldirection 230 and the height or size 262 of the air outlet in thevertical direction 230 which are shown to be equal to or greater than asize 270 in the vertical direction 230 of a spatial area occupied by theplurality of layers of fixed plates 11-14. Thence, the height 261 of theair inlet 240 and the height 262 of the air outlet 250 in the verticaldirection 230 are equal to or greater than the height 270 of theplurality of layers of fixed plates 11-14 in the vertical direction 230.As part of the cooling mechanism of the server case, a first set of fans15 is provided on an inward-facing side of the air inlet 240, and asecond set of fans 16 is provided on an inward-facing side of the airoutlet 250. The first set of fans 15 and the second set of fans 16generate a high-pressure airflow traveling in a straight direction 17from the air inlet 240 to the air outlet 250. Under this design, thehigh-pressure airflow flows through the plurality of layers of plates11-14 to bring the heated air out of the computer server case via theair outlet 250, thus providing efficient cooling of the plurality oflayers of plates 11-14.

In some embodiments of the present disclosure, the first layer of fixedplate 11, the second layer of fixed plate 12, the third layer of fixedplate 13 and the fourth layer of fixed plate 14 may be mounted on athird side panel and a fourth side panel (the third side panel and thefourth side panel being opposite to each other) of the outer shell ofthe case. For example, slots may be provided on the third side panel andthe fourth side panel for mounting the first layer of fixed plate 11,the second layer of fixed plate 12, the third layer of fixed plate 13and the fourth layer of fixed plate 14. Alternatively, the first layerof fixed plate 11, the second layer of fixed plate 12, the third layerof fixed plate 13 and the fourth layer of fixed plate 14 may be mountedfixedly to the third side panel and the fourth side panel by means ofwelding or fastening by screws. The present disclosure is not limited tothese embodiments.

As shown in FIG. 2, which is a schematic diagram showing a structure ofthe first layer of fixed plate 11, a motherboard 11 a, a hard drive 11 band a power source 11 c are provided on the first layer of fixed plate11. The motherboard 11 a includes two CPUs. Of course, the layout of themotherboard 11 a, the hard drive 11 b and the power source 11 c on thefirst layer of fixed plate 11 is not limited to the one shown in FIG. 2and can be configured flexibly by those skilled in the art. For example,the hard drive 11 b and the power source 11 c may be arranged on theleft side in FIG. 2 and the motherboard 11 a may be arranged on theright side in FIG. 2. The present disclosure is not limited to anyspecific layout.

As shown in FIG. 3, which is a schematic diagram showing a structure ofthe second layer of fixed plate 12, two graphics cards 12 a are providedon the second layer of fixed plate 12, each including a GPU. Of course,the layout of the two graphics card 12 a is not limited to the one shownin FIG. 3 and may be configured flexibly by those skilled in the art.

As shown in FIG. 4, which is a schematic diagram showing a structure ofthe third layer of fixed plate 13, two graphics cards 12 a are providedon the third layer of fixed plate 13, each including a GPU.

As shown in FIG. 5, which is a schematic diagram showing a structure ofthe fourth layer of fixed plate 14, two expansion cards 14 a (which canbe USB expansion cards) are provided on the fourth layer of fixed plate14.

In some embodiments, the first layer of fixed plate 11, the second layerof fixed plate 12, the third layer of fixed plate 13 and the fourthlayer of fixed plate 14 are not necessarily mounted in any strict orderin the vertical direction. From the bottom to the top of the case, theymay be arranged in the order of the first layer of fixed plate 11, thesecond layer of fixed plate 12, the third layer of fixed plate 13 andthe fourth layer of fixed plate 14, in the order of the fourth layer offixed plate 14, the third layer of fixed plate 13, the second layer offixed plate 12 and the first layer of fixed plate 11, or in the order ofthe fourth layer of fixed plate 14, the first layer of fixed plate 11,the second layer of fixed plate 12 and the third layer of fixed plate13. The present disclosure is not limited to any of these orders.

In some embodiments of the present disclosure, the first set of fans 15and the second set of fans 16 may each include a plurality of fans. Thenumber of fans in each set may be configured flexibly depending onactual requirements. For example, the more components for which heatdissipation is desired, or the larger the space for which heatdissipation is desired, the more fans may be to be mounted. FIG. 6 is aschematic diagram showing a structure of the first set of fans 15. FIG.7 is a schematic diagram showing a structure of the second set of fans16. In FIGS. 6 and 7, the first set of fans 15 and the second set offans 16 each include four fans.

In order to further increase the speed of heat dissipation for the heatgenerating components, in some embodiments of the present disclosure, afirst heat sink 17 and a second heat sink 18 may be also provided in thecase.

The first heat sink 17 may be connected to the heat generatingcomponents, for absorbing heat from the heat generating components andtransferring the absorbed heat to the second heat sink 18. Here, theheat generating components include the CPUs on the motherboard on thefirst layer of fixed plate 11 and the CPUs on the graphics cards on thesecond layer of fixed plate 12 and the third layer of fixed plate 13.

The second heat sink 18 is mounted on an inward-facing side of thesecond set of fans 16 and cooled by the high-pressure airflow.

In some embodiments of the present disclosure, the first heat sink 17may transfer the heat generated by the heat generating componentsdirectly to the second heat sink 18, and then the first set of fans 15and the second set of fans 16 generate a high-pressure airflow forcooling the second heat sink 18. With the embodiments of the presentdisclosure, the first heat sink 17 may transfer the heat generated bythe heat generating components directly and quickly to the second heatsink 18, so as to increase the speed of heat dissipation and ensure thatthe heat generating components may function stably. Further, the secondheat sink 18 may be arranged near the air outlet on the outer shell ofthe case, such that the high-pressure airflow may dissipate the heat onthe second heat sink 18 quickly to the outside of the case, therebyfurther increasing the speed of heat dissipation and improving thecooling effect.

In some embodiments of the present disclosure, the second heat sink 18may be configured as cooling fins formed in one piece, or a plurality ofsets of cooling fins. This may be configured flexibly by those skilledin the art depending on actual requirements and the present disclosureis not limited to any of these configurations.

In some embodiments of the present disclosure, the first heat sink 17may have any of the following structures.

Structure 1: The first heat sink 17 may include a plurality of sets ofheat pipes 171, each set of heat pipes 171 corresponding to one heatgenerating component.

Structure 2: The first heat sink 17 may include a plurality of turbofanheat sinks 172 each corresponding to one heat generating component.

Structure 3: The first heat sink 17 may include at least one set of heatpipes 171 and at least one turbofan heat sink 172, each set of heatpipes 171 corresponding to one heat generating component and eachturbofan heat sink 172 corresponding to one heat generating component.

In addition to the above Structures 1, 2 and 3, in some embodiments ofthe present disclosure, the first heat sink 17 may include at least onewater cooling device each corresponding to a plurality of heatgenerating components and including a water cooling pipe and a watertank arranged cyclically. The water cooling pipe may have a water inletand a water outlet each connected to the water tank. Water in the watercooling pipe, when flowing through one heat generating component, maycarry heat generated by the one heat generating component to the secondheat sink 18 and then flow from the second heat sink 18 and through anext heat generating component.

In the following, the above Structures 1, 2 and 3 will be described indetail with reference to the figures, such that the structures of theabove heat pipe 171 and turbofan heat sink 172 can be better understoodby those skilled in the art.

Example 1

Referring to FIG. 8A, which is a schematic diagram showing a structureof a first heat sink 17 according to some embodiments of the presentdisclosure, the first heat sink 17 includes a plurality of sets of heatpipes 171. Each set of heat pipes 171 corresponds to one heat generatingcomponent and includes at least one heat pipe each having one end 171 aconnected to the one heat generating component and another end 171 bconnected to the second heat sink 18.

In some embodiments of the present disclosure, for different heatgenerating components, different numbers of heat pipes may be includedin their corresponding sets of heat pipes. For example, the higher thepower of the heat generating component is, the larger number of heatpipes its corresponding set of heat pipes may include.

In order to further increase the contact area between the heat pipes andthe heat generating component and thus the speed at which the heat pipesabsorb the heat, in some embodiments of the present disclosure, the heatgenerating component may have its surface coated with a layer ofthermally conductive silicone grease. The one end 171 a of each heatpipe in each set of heat pipes may be connected to the heat generatingcomponent via one first mounting device.

In an example, the first mounting device may have a structure shown inFIG. 8B. As shown, the first mounting device may include a heat pipebase c1 and a heat pipe cover c2. The heat pipe base c1 may be mountedfixedly on the thermally conductive silicone grease for the heatgenerating component and has at least one groove or slot provided on itstop for mounting the at least one heat pipe. The one end 171 a of eachheat pipe in each set of heat pipes is pressed tightly onto the heatpipe base c1 by the heat pipe cover c2. The heat pipe base c1 and theheat pipe cover c2 may be fastened to each other by screws or bolts.

Of course, in another example, the first mounting device may include aheat pipe base and a heat pipe cover. The heat pipe base may be mountedfixedly on the thermally conductive silicone grease for the heatgenerating component, and the heat pipe cover may have at least onegroove or slot provided at its bottom for mounting the at least one heatpipe. The one end 171 a of each heat pipe in each set of heat pipes ispressed tightly onto the heat pipe base by the heat pipe cover. The heatpipe base and the heat pipe cover may be fastened to each other byscrews or bolts.

Of course, in another example, the first mounting device can include aheat pipe base, which is mounted fixedly on the thermally conductivesilicone grease for the heat generating component. The one end 171 a ofeach heat pipe in each set of heat pipes is welded to the heat pipebase.

In order to further increase the speed of heat dissipation, in someembodiments of the present disclosure, each of the heat pipe cover c2and the heat pipe base c1 of the above first mounting device may haveits surface coated uniformly with a layer of thermally conductivesilicone grease, and/or the one end 171 a of the heat pipe may have itssurface coated uniformly with a layer of thermally conductive siliconegrease.

In some embodiments of the present disclosure, the heat pipe may includea pipe shell, a wick within the pipe shell and a pipe cover for sealingthe pipe shell. The pipe shell may be filled with a volatile liquidhaving a low boiling point.

In some embodiments of the present disclosure, the wick may be made of aporous material.

In some embodiments of the present disclosure, air may be drawn out toform a negative pressure of 1.3*10⁻¹˜1.3*10⁻⁴ Pa inside the pipe shelland then the pipe shell may be filled with the volatile liquid havingthe low boiling point. When the wick is filled with the liquid, the pipeshell may be sealed with the pipe cover.

The principle of the heat pipe absorbing the heat from the heatgenerating component and transferring the absorbed heat to the secondheat sink 18 may be as follows. When the one end 171 a of the heat pipeis heated, the liquid in the wick may be vaporized into vapor and theheat generated by the heat generating component may be absorbed duringthe vaporization of the liquid. The vapor flows may toward the other end171 b of the heat pipe, subject to a small pressure, and may beliquefied into a liquid when meeting the second heat sink 18 having arelatively low temperature at the other end 171 b (as the second heatsink 18 is continuously cooled by the high-pressure airflow, it has alower temperature than the heat pipe 171). During the liquefaction ofthe vapor, heat may be released to the second heat sink 18. The liquidmay flow back to the one end 171 a, subject to a capillary force of thewick. Cyclically in this way, the heat generated by the heat generatingcomponent may be transferred to the second heat sink 18.

In some embodiments of the present disclosure, the material of the heatpipe and the type of the liquid may be any of the following: 1) the pipeshell of the heat pipe may be made of copper and the liquid may bewater; 2) the pipe shell of the heat pipe may be made of carbon steeland the liquid may be water; 3) the pipe shell of the heat pipe may bemade of a composite of steel and copper and the liquid may be water; 4)the pipe shell of the heat pipe may be made of aluminum and the liquidmay be acetone; or 5) the pipe shell of the heat pipe may be made ofstainless steel and the liquid may be sodium.

For example, each CPU on the motherboard may correspond to a set of fiveheat pipes each having a diameter of 6 mm and each GPU on the graphicscard may correspond to a set of four heat pipes each having a diameterof 6 mm. The liquid filled in each heat pipe may be water.

In some embodiments of the present disclosure, the other end 171 b ofeach heat pipe in each set of heat pipes may be connected to the secondheat sink 18 by means of welding.

In some embodiments of the present disclosure, the heat pipe may have ashape of a prism, e.g., a cylinder or cuboid, and the present disclosureis not limited thereto.

FIG. 8C is a schematic diagram showing each GPU in the graphics card 12a on the second layer of fixed plate 12 corresponding to a set of heatpipes. FIG. 8C shows a set of heat pipes 171 connected to a heatgenerating component (GPU) 181 such that the one end 171 a of a heatpipe in the set of heat pipes is connected to the heat generatingcomponent via a first mounting device 191 and another end 171 b of theheat pipe in the set of heat pipes is connected to a second heat sink18. FIG. 8D is a schematic diagram showing each GPU in the graphics card12 a on the third layer of fixed plate 13 corresponding to a set of heatpipes. FIG. 8E is a schematic diagram showing each of the CPUs on thesecond layer of fixed plate 12 and the third layer of fixed plate 13corresponding to a set of heat pipes, the other end 171 b of each of thefour sets of heat pipes being connected to the second heat sink 18.

Example 2

Referring to FIG. 9A, which shows another structure of a first heat sink17 according to some embodiments of the present disclosure, the firstheat sink 17 includes a plurality of turbofan heat sinks 172 eachcorresponding to one heat generating component. Each of the plurality ofturbofan heat sinks 172 includes a cooling fin 172 a connected to theheat generating component and a turbofan 172 b. The turbofan 172 b hasan air outlet facing a same direction as the high-pressure airflow. Theturbofan 172 b draws air to blow heat on the cooling fin 172 a to thesecond heat sink 18. As shown in FIG. 9B, each CPU on the first layer offixed plate 11 corresponds to one turbofan heat sink 172.

Preferably, in order to further increase the contact area between theturbofan heat sink 172 and the heat generating component and thus thespeed at which the heat is absorbed, in some embodiments of the presentdisclosure, the heat generating component may have its surface coatedwith a layer of thermally conductive silicone grease. The cooling fin172 a of the turbofan heat sink 172 may be mounted fixedly on thethermally conductive silicone grease for the heat generating component.

Example 3

According to an embodiment of the present disclosure, in a furtherexample of a first heat sink 17, the first heat sink 17 may include atleast one set of heat pipes 171 and at least one turbofan heat sink 172,each set of heat pipes 171 corresponding to one heat generatingcomponent and each turbofan heat sink 172 corresponding to one heatgenerating component. For the structures of the heat pipe 171 and theturbofan heat sink 172, reference can be made to the above Example 1 andExample 2 and details thereof will be omitted here.

For example, some of the heat generating components in the case may eachhave a turbofan heat sink 172 provided thereon and some of the heatgenerating components in the case may each have heat pipes 171 providedthereon. For example, each CPU on the first layer of fixed plate 11 maycorrespond to a turbofan heat sink 172, and each GPU on the second layerof fixed plate 12 and the third layer of fixed plate 13 may correspondto a set of heat pipes 171. As another example, each CPU on the firstlayer of fixed plate 11 may correspond to a set of heat pipes 171 andeach GPU on the second layer of fixed plate 12 and the third layer offixed plate 13 may correspond to a turbofan heat sink 172. This can beselected flexibly by those skilled in the art depending on actualrequirements and the present disclosure is not limited thereto.

FIG. 10 is a schematic diagram showing a structure in which the firstlayer of fixed plate 11, the second layer of fixed plate 12, the thirdlayer of fixed plate 13, the first set of fans 15 and the second set offans 16 are assembled together.

FIG. 11 is a schematic diagram showing a structure in which the firstlayer of fixed plate 11, the second layer of fixed plate 12, the thirdlayer of fixed plate 13 and the fourth layer of fixed plate 14 areassembled together according to an embodiment of the present disclosure.

In order to further improve the efficiency of heat dissipation, in someembodiments of the present disclosure, a layer of cooling fins may beprovided on a surface of the motherboard on the first layer of fixedplate 11, for absorbing heat generated by other components on themotherboard. Additionally or alternatively, a layer of cooling fins maybe provided on a surface of each graphics card on the second layer offixed plate 12 and the third layer of fixed plate 13, for absorbing heatgenerated by other components on the graphics card. The layer of coolingfins provided on the surface of the motherboard and the layer of coolingfins provided on the surface of the graphics card may be cooled using ahigh-pressure airflow. As shown in FIG. 12, a layer of cooling fins isprovided on a surface of a graphics card on the second layer of fixedplate 12.

Embodiment 2

As shown in FIG. 13, a computer server is provided according toEmbodiment 2 of the present disclosure. The computer server includes sixlayers of fixed plates. In an internal space of a case, a first layer offixed plate 21, a second layer of fixed plate 22, a third layer of fixedplate 23, a fourth layer of fixed plate 24, a fifth layer of fixed plate25 and a sixth layer of fixed plate 26 are arranged in a verticaldirection from a bottom of the case to a top of the case. The firstlayer of fixed plate 21 has a motherboard and a power source ascomponents provided thereon. The second layer of fixed plate 22 has atleast one graphics card as a component provided thereon. The third layerof fixed plate 23 has at least one graphics card as a component providedthereon. The fourth layer of fixed plate 24 has at least one hard driveas a component provided thereon. The fifth layer of fixed plate 25 hasat least one expansion card as a component provided thereon. The sixthlayer of fixed plate 26 has at least one motherboard as a componentprovided thereon. An air inlet is provided on a first side panel of anouter shell of the case, and an air outlet is provided a second sidepanel of the outer shell of the case, the first side panel and thesecond side panel being opposite to each other. A height of the airinlet and a height of the air outlet in the vertical direction beingequal to or greater than a height of the plurality of layers of fixedplates 21-26 in the vertical direction. A first set of fans 35 isprovided on an inward-facing side of the air inlet, and a second set offans 36 is provided on an inward-facing side of the air outlet. Thefirst set of fans 35 and the second set of fans 36 generate ahigh-pressure airflow traveling in a straight direction 17 from the airinlet to the air outlet.

In Embodiment 2 of the present disclosure, the first layer of fixedplate 21, the second layer of fixed plate 22, the third layer of fixedplate 23, the fourth layer of fixed plate 24, the fifth layer of fixedplate 25 and the sixth layer of fixed plate 26 may be mounted on a thirdside panel and a fourth side panel (the third side panel and the fourthside panel being opposite to each other) of the outer shell of the case.For example, slots may be provided on the third side panel and thefourth side panel for mounting the first layer of fixed plate 21, thesecond layer of fixed plate 22, the third layer of fixed plate 23, thefourth layer of fixed plate 24, the fifth layer of fixed plate 25 andthe sixth layer of fixed plate 26. Alternatively, the first layer offixed plate 21, the second layer of fixed plate 22, the third layer offixed plate 23, the fourth layer of fixed plate 24, the fifth layer offixed plate 25 and the sixth layer of fixed plate 26 may be mountedfixedly to the third side panel and the fourth side panel by means ofwelding or fastening by screws. The present disclosure is not limited tothese embodiments.

In some embodiments, the first layer of fixed plate 21, the second layerof fixed plate 22, the third layer of fixed plate 23, the fourth layerof fixed plate 24, the fifth layer of fixed plate 25 and the sixth layerof fixed plate 26 are not necessarily mounted in any strict order in thevertical direction. From the bottom to the top of the case, they may bearranged in the order of the first layer of fixed plate 21, the secondlayer of fixed plate 22, the third layer of fixed plate 23, the fourthlayer of fixed plate 24, the fifth layer of fixed plate 25 and the sixthlayer of fixed plate 26, in the order of the first layer of fixed plate21, the third layer of fixed plate 23, the second layer of fixed plate22, the fourth layer of fixed plate 24, the fifth layer of fixed plate25 and the sixth layer of fixed plate 26, or in the order of the firstlayer of fixed plate 21, the second layer of fixed plate 22, the thirdlayer of fixed plate 23, the fifth layer of fixed plate 25, the fourthlayer of fixed plate 24 and the sixth layer of fixed plate 26. Thepresent disclosure is not limited to any of these orders.

As shown in FIG. 14, which is a schematic diagram showing a structure ofthe first layer of fixed plate 21, a motherboard 21 a and a power source21 b are provided on the first layer of fixed plate 21. The motherboard21 a includes two CPUs. Of course, the layout of the motherboard 21 aand the power source 21 b on the first layer of fixed plate 21 is notlimited to the one shown in FIG. 14 and can be configured flexibly bythose skilled in the art. For example, the power source 21 b may bearranged on the left side in FIG. 14 and the motherboard 21 a may bearranged on the right side in FIG. 14. The present disclosure is notlimited to any specific layout.

As shown in FIG. 15, which is a schematic diagram showing a structure ofthe second layer of fixed plate 22, one graphics card 22 a is providedon the second layer of fixed plate 22, each graphics card 22 a includinga GPU.

As shown in FIG. 16, which is a schematic diagram showing a structure ofthe third layer of fixed plate 23, two graphics cards 22 a are providedon the third layer of fixed plate 23, each including a GPU. Of course,the layout of the two graphics card 22 a is not limited to the one shownin FIG. 16 and can be configured flexibly by those skilled in the art.

As shown in FIG. 17, which is a schematic diagram showing a structure ofthe fourth layer of fixed plate 24, one hard drive 24 a is provided onthe fourth layer of fixed plate 24.

As shown in FIG. 18, which is a schematic diagram showing a structure ofthe fifth layer of fixed plate 25, two expansion cards 25 a (which canbe USB expansion cards) are provided on the fifth layer of fixed plate25.

As shown in FIG. 19, which is a schematic diagram showing a structure ofthe sixth layer of fixed plate 26, one motherboard 21 a is provided onthe sixth layer of fixed plate 26 in an upside down manner.

Preferably, in some embodiments of the present disclosure, the first setof fans 35 and the second set of fans 36 may each include a plurality offans. The number of fans in each set may be configured flexiblydepending on actual requirements. For example, the more components forwhich heat dissipation is desired, or the larger the space for whichheat dissipation is desired, the more fans may be to be mounted. For thestructures of the first set of fans 35 and the second set of fans 36,reference can be made to the first set of fans 15 and the second set offans 16 in Embodiment 1 and details thereof will be omitted here.

In order to further increase the speed of heat dissipation for the heatgenerating components, in some embodiments of the present disclosure, afirst heat sink and a second heat sink are also provided in the case.

The first heat sink is connected to the heat generating components, forabsorbing heat from the heat generating components and transferring theabsorbed heat to the second heat sink. Here, the heat generatingcomponents include the CPUs on the first layer of fixed plate 21 and thesixth layer of fixed plate 26 as well as the CPUs on the second layer offixed plate 22 and the third layer of fixed plate 23.

The second heat sink is mounted on an inward-facing side of the secondset of fans 36 and cooled by the high-pressure airflow.

In the embodiments of the present disclosure, the first heat sink maytransfer the heat generated by the heat generating components directlyto the second heat sink, and then the first set of fans 35 and thesecond set of fans 36 may generate a high-pressure airflow for coolingthe second heat sink. With the embodiments of the present disclosure,the first heat sink may transfer the heat generated by the heatgenerating components directly and quickly to the second heat sink, soas to increase the speed of heat dissipation and ensure that the heatgenerating components may function stably. Further, the second heat sinkmay be arranged near the air outlet on the outer shell of the case, suchthat the high-pressure airflow may dissipate the heat on the second heatsink quickly to the outside of the case, thereby further increasing thespeed of heat dissipation and improving the cooling effect.

In embodiments of the present disclosure, the second heat sink may beconfigured as cooling fins formed in one piece, or a plurality of setsof cooling fins. This can be configured flexibly by those skilled in theart depending on actual requirements and the present disclosure is notlimited to any of these configurations.

In some embodiments of the present disclosure, the first heat sink mayhave any of the following structures.

Structure 1: The first heat sink may include a plurality of sets of heatpipes, each set of heat pipes corresponding to one heat generatingcomponent.

Structure 2: The first heat sink may include a plurality of turbofanheat sinks each corresponding to one heat generating component.

Structure 3: The first heat sink may include at least one set of heatpipes and at least one turbofan heat sink, each set of heat pipescorresponding to one heat generating component and each turbofan heatsink corresponding to one heat generating component.

In addition to the above Structures 1, 2 and 3, in an embodiment of thepresent disclosure, the first heat sink may include at least one watercooling device each corresponding to a plurality of heat generatingcomponents and including a water cooling pipe and a water tank arrangedcyclically. The water cooling pipe may have a water inlet and a wateroutlet each connected to the water tank. Water in the water coolingpipe, when flowing through one heat generating component, carry heatgenerated by the one heat generating component to the second heat sinkand then flow from the second heat sink and through a next heatgenerating component.

In order to further increase the contact area between the heat pipes andthe heat generating component and thus the speed at which the heat pipesabsorb the heat, in embodiments of the present disclosure, the heatgenerating component may have its surface coated with a layer ofthermally conductive silicone grease. The one end of each heat pipe ineach set of heat pipes may be connected to the heat generating componentvia a first mounting device.

In Embodiment 2 of the present disclosure, for the structure of the heatpipe, the structure of the turbofan heat sink, the principle for thefirst heat sink to absorb heat from the heat generating component andtransfer the absorbed heat to the second heat sink, the structure of thefirst mounting device, the scheme in which the heat pipe is mountedfixedly to the heat generating component via the first mounting device,and the scheme in which the turbofan heat sink is mounted fixedly to theheat generating component, reference can be made to the correspondingdescription in Embodiment 1 and details thereof will be omitted here.

In Embodiment 2 of the present disclosure, each of the heat generatingcomponents in the case may each have a set of heat pipes providedthereon, or each of the heat generating components in the case may eachhave a turbofan heat sink provided thereon. Alternatively, some of theheat generating components may each have a turbofan heat sink providedthereon and some of the heat generating components may each have heatpipes provided thereon. For example, each CPU on the first layer offixed plate 21 and the sixth layer of fixed plate 26 may correspond to aturbofan heat sink, and each GPU on the second layer of fixed plate 22and the third layer of fixed plate 23 may correspond to a set of heatpipes. As another example, each CPU on the first layer of fixed plate 21and the sixth layer of fixed plate 26 may correspond to a set of heatpipes and each GPU on the second layer of fixed plate 22 and the thirdlayer of fixed plate 23 can correspond to a turbofan heat sink. This canbe selected flexibly by those skilled in the art depending on actualrequirements and the present disclosure is not limited thereto.

In order to further improve the efficiency of heat dissipation, in someembodiments of the present disclosure, a layer of cooling fins may beprovided on a surface of each motherboard on the first layer of fixedplate 21 and the sixth layer of fixed plate 26 and a layer of coolingfins may be provided on a surface of each graphics card on the secondlayer of fixed plate 22 and the third layer of fixed plate 23, forabsorbing heat generated by other components on the motherboards and thegraphics cards. The layer of cooling fins provided on the surface ofeach motherboard or graphics card may be cooled using a high-pressureairflow.

FIG. 20 is a schematic diagram showing a structure in which the firstlayer of fixed plate 21, the second layer of fixed plate 22 and theircorresponding heat sinks are assembled together. FIG. 20 shows examplesof the positions and arrangements of the following elements: bottom 210of the case, top 220 of the case, vertical direction 230 from the bottomto the top of the case, air outlet 250, height 261 of the air inlet inthe vertical direction, height 262 of the air outlet 250 in the verticaldirection, and height 270 of the plurality of layers of fixed plates inthe vertical direction.

FIG. 21 is a schematic diagram showing a structure in which the firstlayer of fixed plate 21, the second layer of fixed plate 22, the thirdlayer of fixed plate 23 and their corresponding heat sinks are assembledtogether.

FIG. 22 is a schematic diagram showing a structure in which the firstlayer of fixed plate 21, the second layer of fixed plate 22, the thirdlayer of fixed plate 23, the fourth layer of fixed plate 24 and theircorresponding heat sinks are assembled together.

FIG. 23 is a schematic diagram showing a structure in which the firstlayer of fixed plate 21, the second layer of fixed plate 22, the thirdlayer of fixed plate 23, the fourth layer of fixed plate 24, the fifthlayer of fixed plate 25 and their corresponding heat sinks are assembledtogether.

FIG. 24 is a schematic diagram showing a structure in which the firstlayer of fixed plate 21, the second layer of fixed plate 22, the thirdlayer of fixed plate 23, the fourth layer of fixed plate 24, the fifthlayer of fixed plate 25, the sixth layer of fixed plate 26 and theircorresponding heat sinks are assembled together.

FIG. 25 is a schematic diagram showing a structure in which the firstlayer of fixed plate 21, the second layer of fixed plate 22, the thirdlayer of fixed plate 23, the fourth layer of fixed plate 24, the fifthlayer of fixed plate 25, the sixth layer of fixed plate 26 and theircorresponding heat sinks, the outer shell of the case, the first set offans 35 and the second set of fans 36 are assembled together accordingto Embodiment 2 of the present disclosure. FIG. 25 shows the followingelements: bottom 210 of the case, top 220 of the case, verticaldirection 230 from the bottom to the top of the case, air inlet 240, airoutlet 250, height 261 of the air inlet 240 in the vertical direction,height 262 of the air outlet 250 in the vertical direction, and height270 of the plurality of layers of fixed plates in the verticaldirection. As illustrated, the height or size 262 of the air outlet 250in the vertical direction 230 and the height 261 of the air inlet 240 inthe vertical direction 230 are equal to or greater than the height 270of the plurality of layers of fixed plates 11-14 in the verticaldirection 230 which serves to provide efficient air cooling to theplurality of layers of fixed plates 11-14.

While the embodiments of the present disclosure have been describedabove, further alternatives and modifications can be made to theseembodiments by those skilled in the art in light of the basic inventiveconcept of the present disclosure. The claims as attached are intendedto cover the above embodiments and all these alternatives andmodifications that fall within the scope of the present disclosure.

Obviously, various modifications and variants can be made to the presentdisclosure by those skilled in the art without departing from the spiritand scope of the present disclosure. Therefore, these modifications andvariants are to be encompassed by the present disclosure if they fallwithin the scope of the present disclosure as defined by the claims andtheir equivalents.

What is claimed is:
 1. A computer server, comprising, in an internalspace of a case, a plurality of layers of fixed plates arranged in avertical direction from a bottom of the case to a top of the case, eachof the plurality of layers of fixed plates having at least onecorresponding component provided thereon, wherein an air inlet isprovided on a first side panel of an outer shell of the case, an airoutlet is provided on a second side panel of the outer shell of thecase, the first side panel and the second side panel being opposite toeach other, a height of the air inlet and a height of the air outlet inthe vertical direction being equal to or greater than a height of theplurality of layers of fixed plates in the vertical direction, a firstfan set and a second fan set, configured to generate a high-pressureairflow in the internal space, are respectively provided at the airinlet and the air outlet, and the component on each of the plurality oflayers of fixed plates is cooled by the high-pressure airflow.
 2. Thecomputer server of claim 1, wherein the plurality of layers of fixedplates comprises a first configuration or a second configuration,wherein the first configuration comprises: a first layer of fixed platehaving a motherboard, a hard drive and a power source provided thereonas its corresponding components; a second layer of fixed plate having atleast one graphics card provided thereon as its corresponding component;a third layer of fixed plate having at least one graphics card providedthereon as its corresponding component; and a fourth layer of fixedplate having at least one expansion card provided thereon as itscorresponding component; and wherein the second configuration comprises:a first layer of fixed plate having a motherboard and a power sourceprovided thereon as its corresponding components; a second layer offixed plate having at least one graphics card provided thereon as itscorresponding component; a third layer of fixed plate having at leastone graphics card provided thereon as its corresponding component; afourth layer of fixed plate having at least one hard drive providedthereon as its corresponding component; a fifth layer of fixed platehaving at least one expansion card provided thereon as its correspondingcomponent; and a sixth layer of fixed plate having at least onemotherboard provided thereon as its corresponding component.
 3. Thecomputer server of claim 1, further comprising a first heat sink and asecond heat sink, wherein the at least one component comprises a heatgenerating component, the first heat sink is connected to the heatgenerating component, for absorbing heat from the heat generatingcomponent and transferring the absorbed heat to the second heat sink,the heat generating component comprising a Central Processing Unit (CPU)or a Graphics Processing Unit (GPU), and the second heat sink is mountedon an inward-facing side of the second fan set and cooled by thehigh-pressure airflow.
 4. The computer server of claim 3, wherein thefirst heat sink comprises at least one set of heat pipes, each set ofheat pipes corresponding to one heat generating component and comprisingat least one heat pipe each having one end connected to the one heatgenerating component and another end connected to the second heat sink.5. The computer server of claim 4, wherein the heat generating componenthas its surface coated with a layer of thermally conductive siliconegrease, and the one end of each heat pipe in each set of heat pipes isconnected to its corresponding heat generating component via a firstmounting device, wherein the first mounting device comprises a heat pipebase and a heat pipe cover, the heat pipe base being mounted fixedly onthe thermally conductive silicone grease for the heat generatingcomponent and having at least one groove or slot provided on its top formounting the at least one heat pipe, and wherein the one end of eachheat pipe in each set of heat pipes is pressed tightly onto the heatpipe base by the heat pipe cover.
 6. The computer server of claim 5,wherein the heat pipe comprises a pipe shell, a wick within the pipeshell and a pipe cover for sealing the pipe shell, the pipe shell beingfilled with a volatile liquid having a low boiling point.
 7. Thecomputer server of claim 4, wherein the other end of each heat pipe inthe set of heat pipes is connected to the second heat sink by means ofwelding.
 8. The computer server of claim 3, wherein the first heat sinkcomprises at least one fan associated heat sink corresponding to oneheat generating component, and each of the at least one fan associatedheat sink comprises a cooling fin connected to the heat generatingcomponent, an air outlet facing a same direction as the high-pressureairflow, and the fan drawing air to blow heat on the cooling fin to thesecond heat sink.
 9. The computer server of claim 8, wherein the heatgenerating component has its surface coated with a layer of thermallyconductive silicone grease, and the cooling fin of the fan associatedheat sink is mounted fixedly on the thermally conductive silicone greasefor its corresponding heat generating component.
 10. The computer serverof claim 3, wherein the first heat sink comprises at least one of: afirst group of heat sink elements or a second group of heat sinkelements, wherein the first group of heat sink elements comprises: a setof heat pipes corresponding to one heat generating componentand-comprising at least one heat pipe having one end connected to theone heat generating component and another end connected to the secondheat sink, and wherein the second group of heat sink elements comprises:a fan associated heat sink corresponding to one heat generatingcomponent and comprising a cooling fin connected to the heat generatingcomponent and an air outlet facing a same direction as the high-pressureairflow, and the fan associated heat sink drawing air to blow heat onthe cooling fin to the second heat sink.
 11. The computer server ofclaim 1, wherein the first fan set is on an inward-facing side of theair inlet, and the second fan set is on an inward-facing side of the airoutlet.
 12. The computer server of claim 1, wherein the high-pressureairflow travels in a straight direction from the air inlet to the airoutlet.
 13. The computer server of claim 1, wherein each of the firstfan set and the second fan set comprises a plurality of fans.
 14. Acomputer server, comprising: a server case structured to enclose aninternal space to comprise a plurality of layers of plates arranged in avertical direction from a bottom of the server case to a top of theserver case, each of the plurality of layers of plates is structured tocomprise one or more heat-generating components comprising at least onecircuitry, wherein the server case comprises a first side panel forminga first external side of the server case to comprise an air inlet toallow air to enter the server case, a second side panel forming a secondexternal side of the server case to comprise an air outlet to allow airinside the server case to exit the server case, the first side panel andthe second side panel being on opposite sides of the server case,wherein a first fan set and a second fan set, configured to generate ahigh-pressure airflow in the internal space, are respectively providedat the air inlet and the air outlet, and wherein the computer serverfurther comprises: a first heat sink comprising a set of heat pipe setcomprising at least one heat pipe having one end connected to receiveheat generated from at least one of the plurality of layers of plates totransfer the generated heat to a second end, and a second heat sinkmounted on the second fan set to be cooled by the high-pressure airflowand engaged to the second end of the at least one heat pipe of the firstheat sink to receive heat transferred from the first heat sink.
 15. Thecomputer server as in claim 14, wherein the computer server furthercomprises: a layer of thermally conductive material in contact with theat least one of the plurality of layers of plates to conduct heat; andat least one first mounting device structured to comprise a heat pipebase being mounted fixedly on the thermally conductive material andcomprising at least one groove or slot for mounting the at least oneheat pipe, and a heat pipe cover that is pressed the at least one heatpipe into the heat pipe base.
 16. The computer server as in claim 14,wherein the first fan set on the air inlet and the second fan set on theair outlet are structured to have sizes of the air inlet and the airoutlet to be greater than a size of a spatial area occupied by theplurality of layers of plates in the high-pressure airflow between theair inlet and the air outlet.
 17. A computer server, comprising: aserver case structured to enclose an internal space to comprise aplurality of layers of plates arranged in a vertical direction from abottom of the server case to a top of the server case, wherein theserver case comprises a first side panel forming a first external sideof the server case to comprise an air inlet to allow air to enter theserver case, a second side panel forming a second external side of theserver case to comprise an air outlet to allow air inside the servercase to exit, the first side panel and the second side panel being onopposite sides of the server case, wherein a first fan set and a secondfan set, configured to generate a high-pressure airflow in the internalspace, are respectively provided at the air inlet and the air outlet,and wherein the computer server further comprises: a first heat sinkconnected to receive heat generated from at least one of the pluralityof layers of plates to transfer the generated heat away from the atleast one of the plurality of layers of plates, and a second heat sinkmounted on the second fan set and engaged to receive heat transferredfrom the first heat sink to dissipate the received heat via thehigh-pressure airflow, wherein the first heat sink comprises a coolingfin connected to the at least one of the plurality of layers of platesto receive heat and a fan operable to drive air over the cooling fin ina direction that is away from the fan and is in the same direction asthe high-pressure airflow.
 18. The computer server as in claim 17,comprising a layer of thermally conductive material in contact with theat least one of the plurality of layers of plates to conduct heat,wherein the cooling fin is mounted fixedly on the thermally conductivematerial.
 19. The computer server as in claim 17, wherein the first fanset on the air inlet and the second fan set on the air outlet arepositioned relative one another to generate the high-pressure airflow toflow in a straight line direction from the air inlet to the air outlet.20. The computer server as in claim 17, wherein the first fan set on theair inlet and the second fan set on the air outlet are structured tohave sizes of the air inlet and air outlet to be greater than a size ofa spatial area occupied by the plurality of layers of plates in thehigh-pressure airflow between the air inlet and the air outlet.